Fundamentals of Glass with Thin-Film Functional Coatings for Processors
28 hours / 4 days. Covers Low-E coating principles, PVD vs. pyrolytic films, silver protection, tempering effects, and typical downstream defects. Designed for management, engineers, and shift supervisors in glass processing.
Processes for Deposition of Functional Thin-Film Coatings on Extra-Large Substrates
50 hours / 8 days. Comprehensive overview of PVD methods: magnetron sputtering, evaporation, ion plating, and laser ablation. Equipment configurations, process parameters, monitoring, and industrial applications.
Continuous Magnetron Sputtering Processes for Thin-Film Deposition
54 hours / 8 days. Deep dive into in-line sputtering systems: vacuum architecture, gas delivery, power supplies, process control, in-situ monitoring, and maintenance.
Web and Flexible Substrate Coating Technologies
27 hours / 4 days. Markets, vacuum web systems, transport and winding, pre-treatment, deposition methods, and in-line quality monitoring for roll-to-roll applications.
Plasma-Surface Interactions in Thin Film Deposition
30 hours / 5 days. Low-temperature plasma physics, sputtering mechanisms, blistering, ion-induced erosion, and surface modification. For advanced R&D professionals.
Structural Formation in Thin Film Deposition
25 hours / 4 days. Nucleation, growth modes, microstructure evolution, internal stress, and texture control. Bridges deposition parameters to final film properties.
TCO — Transparent Conductive Oxide Thin-Film Structures
18 hours / 3 days. Fundamentals of conductivity/transparency trade-off, resistivity well engineering, doping strategies, and practical TCO design for devices.
Reactive Ion-Assisted Deposition and Plasma Chemistry
20 hours / 3 days. Plasma-chemical reactions, reactive sputtering hysteresis, arc management, and process optimization for compound thin films.
Fundamentals of CVD Functional Coating Technology
50 hours / 8 days. Complete CVD overview: thermodynamics, kinetics, precursor chemistry, reactor design, materials, and applications.