Corporate Education

Customized training for engineering teams

We unlock the full potential of your technical personnel through highly specialized, on-site intensive programs designed for deep-tech R&D and production environments.

Our curriculum spans the fundamentals of thin-film deposition to advanced statistical process control, LEAN methodologies, and AI-driven R&D — always grounded in real industrial practice.

Thin-Film Technology Courses

From fundamentals to industrial mastery

Fundamentals of Glass with Thin-Film Functional Coatings for Processors

28 hours / 4 days. Covers Low-E coating principles, PVD vs. pyrolytic films, silver protection, tempering effects, and typical downstream defects. Designed for management, engineers, and shift supervisors in glass processing.

Processes for Deposition of Functional Thin-Film Coatings on Extra-Large Substrates

50 hours / 8 days. Comprehensive overview of PVD methods: magnetron sputtering, evaporation, ion plating, and laser ablation. Equipment configurations, process parameters, monitoring, and industrial applications.

Continuous Magnetron Sputtering Processes for Thin-Film Deposition

54 hours / 8 days. Deep dive into in-line sputtering systems: vacuum architecture, gas delivery, power supplies, process control, in-situ monitoring, and maintenance.

Web and Flexible Substrate Coating Technologies

27 hours / 4 days. Markets, vacuum web systems, transport and winding, pre-treatment, deposition methods, and in-line quality monitoring for roll-to-roll applications.

Plasma-Surface Interactions in Thin Film Deposition

30 hours / 5 days. Low-temperature plasma physics, sputtering mechanisms, blistering, ion-induced erosion, and surface modification. For advanced R&D professionals.

Structural Formation in Thin Film Deposition

25 hours / 4 days. Nucleation, growth modes, microstructure evolution, internal stress, and texture control. Bridges deposition parameters to final film properties.

TCO — Transparent Conductive Oxide Thin-Film Structures

18 hours / 3 days. Fundamentals of conductivity/transparency trade-off, resistivity well engineering, doping strategies, and practical TCO design for devices.

Reactive Ion-Assisted Deposition and Plasma Chemistry

20 hours / 3 days. Plasma-chemical reactions, reactive sputtering hysteresis, arc management, and process optimization for compound thin films.

Fundamentals of CVD Functional Coating Technology

50 hours / 8 days. Complete CVD overview: thermodynamics, kinetics, precursor chemistry, reactor design, materials, and applications.

Process Control & Quality Courses

Statistical engineering for repeatable results

Fundamentals of Process Management Methodologies

52 hours / 8 days. Universal introduction to LEAN, Six Sigma, SPC, DMAIC, PDSA, and continuous improvement. Suitable for production, R&D, and administrative personnel.

Process Control in Microelectronics and Thin-Film Technologies

78 hours / 12 days. Expert-level course: advanced SPC, yield modeling, ANOVA, DOE, response surface methodology, nested variance components, and spatial modeling. For hands-on engineers with strong math background.

Fundamentals of Design of Experiments (DoE)

11 hours / 2 days. Practical factorial designs, response surface methods, mixture designs, Taguchi and D-optimal plans, ANOVA, and predictive analysis with software tools.

LEAN Methods in Product & Process Development

34 hours / 5 days. Lean Product Development, Set-Based Concurrent Engineering, Decision Flow Mapping, Knowledge Management, and A3 thinking for R&D transformation.

Emerging Tools & Specialized Topics

Next-generation skills for R&D leaders

Generative AI for Scientific Research

15 hours / 2 days. LLMs for hypothesis generation, literature review automation, code generation for data analysis, and scientific writing. Suitable for PhDs and R&D staff.

AI for Intellectual Property and Knowledge Management

26 hours / 4 days. NLP for patent search, semantic analysis, knowledge graphs, generative AI for patent drafting, and corporate KM systems.

Neural Network Technologies for Data Parsing and FEA

17 hours / 2 days. Surrogate modeling, generative design, and automation of finite element analysis using neural networks. For engineers with FEA experience.

Synchrotron Methods for Surface Analysis

22 hours / 4 days. Synchrotron radiation, XANES, EXAFS, RIXS, XMCD, time-resolved experiments, and neutron sources. For advanced researchers.

Electrochemical Processes in Thin Films and Mesoporous Structures

23 hours / 3 days. Electrode kinetics, impedance spectroscopy, intercalation, supercapacitors, and electrochromic materials.

Modeling of Layered Optical Systems and EM Radiation Interaction

22 hours / 3 days. Thin-film optical design, admittance diagrams, AR coatings, narrowband filters, and optimization algorithms.

Cleaning and Preparation of Optical Substrates

6 hours / 1 day. Solvent and aqueous cleaning, contamination types, surface quality standards for precision optics.

Electrochromic Technologies

Custom duration. Organic and inorganic electrochromic materials, device architectures, electrolyte systems, and durability testing.

Competence Development

From individual skills to organizational capability

SURFONIX training is not a collection of isolated lectures. It is a structured competence development system aligned with your technology roadmap. We map training content to role-based competence matrices, ensuring every program directly strengthens your team's ability to execute.

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Competence Assessment
Pre- and post-training evaluation against defined skill profiles for operators, engineers, and R&D managers.
Role-Based Tracks
Curricula tailored to production operators, process engineers, quality specialists, and technology leaders.
Train-the-Trainer
We build internal training capability so your experts can sustain and scale knowledge transfer independently.

Direct Contact

Initiate a project or technical audit

We engage directly with facility directors, R&D heads, and investors. Reach out through our dedicated executive channels to discuss new product launches, equipment capability reviews, or critical yield troubleshooting.